Ultrasonic Drilling, Milling, and Electrodischarge

Areas of Application
Typical applications for this technology include the processing of very hard ceramic materials, draw dies for wire manufacturing, and the processing of precious stones.

Principal Function of Ultrasonic Drilling, Milling, and Electrodischarge Machining Technology:
As in the case of ultrasonic welding and cutting, the same components are also used for these applications, supplemented by special drilling, milling, or electrodischarge machining tools. Ultrasonic oscillations impinge on the tools (drill, milling cutter, etc.), which oscillate in the micrometer range.
This technology lets you process very hard materials quickly and precisely.

Frequencies 
Typical frequencies used in these ultrasonic applications are 20 kHz, 35 kHz, and 40 kHz. More seldom, a frequency of 15 kHz and systems with a frequency of 70 kHz are also used.

Screening

This technology is wide-spread in the chemical and food industries, in particular. Powdered materials of various compositions are processed.

Principal Function of Ultrasonic Screening Technology:
In the case of ultrasonic screening, sieve frames of all geometries, preferably with mesh sizes of 5 to 50 micrometers, are brought to oscillation through impingement by ultrasonic oscillations.

Frequencies
Typical frequencies used in these ultrasonic applications are 20 kHz, 35 kHz, and 40 kHz. More seldom, a frequency of 15 kHz and systems with a frequency of 70 kHz are also used.

Dispersing and Emulsifying

Frequencies
Typical frequencies used in these ultrasonic applications are 20 kHz, 35 kHz, and 40 kHz. More seldom, a frequency of 15 kHz and systems with a frequency of 70 kHz are also used.